As a member of the Workstation R&D lab team, you will be responsible for leading entry workstation thermal development and integrating the motherboard, components, and accessories into world’s best workstation solution. The successful candidate will have a proven track record of delivering performance platforms with low cost, good quality and on schedule. 

Duties include:

Lead and execute system thermal design and influence product definition to ensure market competitiveness and future-proof

Ownership of entry desktop workstation end-to-end thermal development.

Define system thermal and acoustic spec

Develop fan control algorithms to support business critical components and predefined performance goals

Develop platform thermal and acoustic validation plan, issue tracking and resolution

Work cross-functionally with architects, ID, EE, procurement, quality and supply chain to deliver high quality thermal solutions against aggressive cost and Time-to-Market goals.

Collaborate with other HP business unit or external partners to explore and realize leverage opportunities for thermal solution development

Lead thermal development activities and manage resource at ODM partners

Education and Experience Required: 

Bachelor's or Master's degree in Mechanical Engineering.

Typically 8+ years experience in themral engineering in PC related product.

Experience in performance tuning and system integration.

Knowledge and Skills: 

Track record of great sense of ownership, proactive attitude and being a team player

Strong interpersonal skills to influence

Experience in developing thermal solution for high performance computing systems

Experience in studying SIO spec and developing fan control algorithms based on it

Using ProEngineer or other 3D CAD software as a mechanical design tool.

Using CFD and thermal mockups to validate thermal solution. Strong knowledge of 6SigmaET is a big plus.

Knowledge for shock & vibration issue debug and solution implementation

Experience working with both Asian ODMs and US team

Excellent written and verbal communication skills. Fluent in Mandarin Chinese and good command of English

Ability to establish clear goals and formulate plans to achieve them

Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.

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