Who We Are

We are the Service Provider (SP) Mechanical and Thermal team responsible for the design of Cisco’s best high-performance, provider class routers, the Cisco 8000 series. The Cisco 8000 series utilizes Cisco’s revolutionary Silicon One ASIC that delivers unmatched performance and density with feature-rich functionality.

We are transforming the industry and building a new internet for AI networks and the 5G era, providing a unified, programmable silicon architecture that is the foundation of all Cisco's future routing products.

Our devices are designed to be universally adaptable across service providers and web-scale markets, designed for fixed and modular platforms. Our devices deliver high speed without sacrificing programmability, buffering, power efficiency, scale, or feature flexibility.

You'll be part of our group driving our game-changing next-generation network devices built with Cisco Silicon One™.

What You'll Do

You will be joining the SP platform Mechanical Thermal group in San Jose, CA, which is responsible for designing and developing complex electro-mechanical systems for a variety of networking products from fixed to centralized and distributed architectures with sizes ranging from 1U to 40U. You’ll work with Hardware Distinguished Engineers and Hardware Leads to architect and develop cooling solutions for next generation high performance routing platforms. In this role you’ll tackle the challenges of high-power ASICs and high-density optical transceivers by investigating and implementing innovative, next generation cooling.

High-Level Responsibilities:

• Design and develop thermal solutions (air cooled or liquid cooled) for systems with high-power ASICs and high-density optical transceivers.

• Develop detailed package, board, and system level simulations using Computational Fluid Dynamic tools such as Flotherm or Icepak to simulate and analyze thermal solutions.

• Collaborate with Distinguished Engineers and HW leads on system architectures and cooling.

• Manage or perform thermal testing (including airflow, acoustic, thermocouple testing, modules, and/or platform level validations) to validate simulation models.

• Lead and mentor other thermal engineers in the group.

• Investigate and implement new innovative thermal technologies.

• Collaborate with mechanical engineers, and other cross-functional teams to identify risks, derive tradeoffs and deliver objective, data-driven solutions.

• Develop test plans and test reports and present simulations reports to project team and management.

Who You’ll Work With

You will be working very closely with the rest of our Mechanical/Thermal group, which is a dedicated team with foundations of innovation, teamwork, open communication, and customer success. You’ll also work cross-functionally with Hardware Engineering, Product Management/Marketing, Product Operations, Global Supplier Management (GSM), External Vendors/Suppliers, Manufacturing Operations, and EMS/JDM partners.

Who You Are

You are a creative thinker and an adept problem solver, someone who thrives on tackling difficult challenges with innovative solutions. You exhibit strong technical leadership, driven by a passion for design and innovation. As an excellent team player, you’re open to collaboration, ready to listen and compromise to achieve the best product outcomes. The role requires a self-starter, capable of working independently and effectively translating broader directives into actionable tasks. You can adapt to a constantly changing and dynamic environment, as well as evolving requirements. Outstanding verbal and written communication skills are essential, along with a strong work ethic that complements your commitment to teamwork.

Minimum Qualifications:

• Bachelor’s Degree in Mechanical Engineering with 10+ years of relevant experience or

• Master’s Degree in Mechanical Engineering with 8+ years of relevant experience

• 6+ years of experience in design, simulation, and testing of thermal solutions for electronic devices and systems.

Preferred Qualifications:

• PhD in Mechanical, Thermal Engineering, or relevant degree and 5+ years of relevant experience.

• 5+ years of relevant experience in the thermal design of telecom, compute, or networking equipment.

• Experience in use of Computational Fluid Dynamic analysis tools such as Flotherm or Icepak.

• Knowledge and experience with advanced air-cooling technologies (vapor chamber and remote heat sinks, thermal interface materials, fans/fan trays).

• Experience with designing liquid cooling and/or immersion cooling systems.

• Experience with performing other analysis such as Finite Element Analysis (FEA) and Data Center cooling simulations.

• Proficiency with 3D MCAD modeling tools such as PTC's Creo or NX.

• Knowledge of optical transceiver module types, form factors, and requirements.