Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a DRAM Module HVM Engineer with Central Engineering, DRAM Module and CXL (DMC) group, you will play a crucial role in ensuring the reliability and performance of DRAM Module and CXL products. You will be responsible for addressing customer Return Material Authorizations (RMA) and resolving factory issues, as well as contributing to the design and development of new hardware products.
Job Responsibilities:
Customer support: Work with GQ, FAE and MFG team on customer escalation and to provide technical guidance driving timely and effective solutions.Resolution of RMA: Work with cross functional team to resolve customer return and customer escalation. Analyze the root cause of RMA Memory Module (DIMM, LPCAMM, CXL) and working with cross functional teams to recommend corrective action and recovery plan.Collaboration: Ability to work in a technical lead role independently and with the global cross-functional teams. Collaborate with the customer support team to provide timely and effective solutions. Technical Leadership: Provide technical leadership to support DRAM module activities from NPI to HVM on hardware design-related issues, engage with Design to close FMEA, DFM and DFT issues. Risk Management: Conduct monthly fail-mode analysis and risk assessment from MFG sites and work closely with Design, MFG, GQ, and other engineering team to resolve failures, running DOE, systematically improving both MFG processes and Module Design. Module NPI-HVM: Support product safe launch and certification activities, NPI, HVM manufacturing, including product/MFG processes transfer from design to manufacturing.Skills & Experience
A Bachelor/Master’s degree in Electronics / Mechanical Engineering with 8+ Year of relevant work Experience.Excellent relevant working experience with DRAM module, PMIC, SPD hub and RCD, high-speed interfaces DDR, and communication protocols such as I2C and I3C.Experienced in working end to end of a product cycle in hardware design including hardware architect, circuit design, Debugging, Manufacturing and assembling.Good understanding of High-speed board design, SI and PI concepts, well experienced in system bring-up, characterization and debugging as well as knowledge of laboratory equipment such as oscilloscopes and logic and protocol analyzers.Proficiency in programming languages such as C/C++/ Python, JIRA and Confluence.Candidate with CXL working experience will be advantageous.Work on site in Hsinchu Taiwan with regional Asia travel.About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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