Internship Role intended for current students pursuing their Bachelor’s/Masters degree and having completed their junior year by Summer 2025. This position is located in Burlington, MA

The Team:

The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab.
 

The Company:

Oracle is the world’s leading provider of business software. With a presence in over 175 countries, we are one of the biggest technology companies on the planet. We're using innovative emerging technologies to tackle real-world problems today. From advancing energy efficiency to reimagining online commerce, the work we do is not only transforming the world of business—it's helping advance governments, power nonprofits, and giving billions of people the tools they need to outpace change. For more information about Oracle (NYSE:ORCL), visit us at oracle.com. 

Career Level - IC0