Job Description

About Intel AI:

Intel AI is at the forefront of developing cutting-edge AI processors, designed from the ground up to excel in both training deep neural networks and powering high-performance inference in production environments. We are a dynamic and innovative team dedicated to pushing the boundaries of AI technology.

About the Role:

The Mechanical Engineering Manager will play a crucial role in leading a high-performing team responsible for the end-to-end Mechanical design of our AI systems. This includes architecting, designing, and delivering high-power AI cards, modules, and complete systems for deployment in data centres. The ideal candidate will possess a deep understanding of complex systems, a proven track record of success in leading engineering teams, and a passion for driving innovation in the AI space.

Responsibilities:

Technical Leadership: Provide technical leadership and guidance to a team of highly skilled mechanical engineers.Oversee the complete mechanical engineering lifecycle, from initial concept and design to production and deployment.Ensure adherence to rigorous engineering principles and best practices throughout the development process.Drive innovation and continuous improvement within the mechanical engineering team.System Architecture & Design: Define and refine mechanical architectures for high-performance AI systems, considering factors such as power consumption, thermal management, and cost-effectiveness.Collaborate closely with cross-functional teams (e.g., hardware, production, ODMs) to ensure seamless system integration and optimal performance.Lead the mechanical and thermal design and development of Intel’s cutting edge AI systems from modules thru servers and up to rack levels in different form factors (e.g. OAMs, PCI AIC, Open72) and including all test/validation and production sub-systems and jigs.Drive the selection and evaluation of key components and technologies.Manufacturing & Quality: Ensure the successful transition of designs to manufacturing, including close collaboration with manufacturing partners.Drive continuous improvement in manufacturing processes to enhance yield, quality, and reliability.Implement robust design for manufacturability (DFM) and design for quality (DFQ) methodologies.Technology Scouting & Innovation: Stay abreast of the latest advancements in thermos mechanical technologies. Identify and evaluate emerging technologies and their potential impact on future AI hardware designs.Foster a culture of innovation and encourage experimentation within the team.
Qualifications

Qualifications:

Required:Bachelor’s degree in mechanical engineering (MSc preferred)10+ years of experience in mechanical engineering, with a strong focus on complex, high-power systems.Proven experience leading and mentoring engineering teams.Deep understanding of Mechanical/Thermal design and electronics packaging of Air and liquid cooled systems for IT/AI/HPC data-centersExpertise in different manufacturing methods including sheet-metal, CNC, casting and injection molding for medium and high mass production qtysStrong analytical and problem-solving skills.Excellent communication and interpersonal skills.

Preferred:

Experience with Data Centre, AI/ML accelerators, or deep learning systems.Familiarity with manufacturing processes.Experience with thermal management solutions for high-power systems.Knowledge of industry standards and best practices in mechanical engineering.Experience in reliability and environmental standards and testing BKMs of IT/AI/HPC systems for data-centers.Experience in FEM static/dynamics/fatigue Mechanical simulation and thermal/flow (CFD) simulations and analytical thermal/flow calculationKnowledge in Large BGA ASICs design and reliability testing and simulationsExperience in 2 phase cooling systemsKnowledge of OCP standards

Primary Location:

Caesarea
Inside this Business Group
The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.