Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Drives NPI engineering execution excellence. Accountable for global NPI success metrics goals. Lead the global PIE team focus on MTB, MXA and OSAT in support of key operation objectives including safety, quality, cost and on-time delivery for all NPI product lines. Concisely and effectively communicate strategic and tactical execution status to executive management (i.e. PDE VPs, MMP Site VPs and Mini-Pioneer & Pioneer Executive team) and multi-functional teams.Ensures that, strategies, and processes address high value problems for the operations engineering and is aligned with the organizational goals.Responsible for driving complex assembly engineering programs in accordance with packaging roadmaps.Track industry trends and developments in key areas of Package Engineering.Drives and support network initiatives pertaining to cost-reduction, production throughput improvement, process flows simplification, global standardization.Improve efficiency and productivity through extensive process analysis and interdepartmental collaborationAnticipates future needs and initiates the development and implementation of new approaches to package engineering with exceptional scope and significant customer impact.Promote a culture of discipline in cost control and productivity, ensuring maximum focus across all manufacturing activities based on established key performance indicators.Chart and execute the people development plan to ensure CEM engineering cohort performs at a sustained HIGH LEVEL, meeting increasing technical complexity and challenging customer demands.Partner with Human Resources to ensure appropriate staffing levels, training and performance management.Requirements ：
Bachelor's or Master's degree in Mechanical/Electric or Material Engineering, or a related field.Minimum of 10 years’ experience in semiconductor engineering, with at least 5 years in a managerial role.Up-to-date knowledge of the industry.Proven track record in technical mentorship and leadership.Strong communication and teamwork skills.Familiarity with new products introduction process.Flexibility to work across global time zones is required.Exposure to working on high-volume distributed systems.Previous experience in backend packaging area is a plus.About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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